A remanufacturing and green packaging initiative has been launched to stimulate growth in eco-friendly industries.
Supported by Spring Singapore, it targets remanufacturers, precision engineering service providers and companies interested in venturing into remanufacturing.
The Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Agency for Science, Technology and Research (A*Star), is promoting green manufacturing in research and development (R&D) collaborations on remanufacturing technologies with Nanyang Technological University (NTU) and National University of Singapore (NUS).
Said Raj Thampuran, executive director of A*Star’s Science and Engineering Research Council (SERC): ‘Remanufacturing is a key market space that is under-tapped by our local industry. A*Star’s investment in R&D of remanufacturing technologies will not only spur the growth of new industries, with firm foundations in these technologies, but also enhance the environment by reducing greenhouse gas emissions. We may well see the growth of more eco-friendly industries in Singapore in the near future.’
SIMTech will engage NUS and NTU to jointly develop competitive remanufacturing technologies for Singapore’s manufacturing industry.
Three joint labs will be established by SIMTech and NTU to develop remanufacturing-related technologies in refurbishing and reliability assessment. They will also aim to nurture R&D talent for the remanufacturing industry. The initial focus of the labs will be on reliability, precision machining and 3D additive manufacturing.
‘The joint labs aim to come up with innovative manufacturing and industrial processes that are sustainable, efficient and cost-effective – factors which are crucial to the industry of today,’ says Freddy Boey, deputy president and provost of NTU.
Key beneficiaries of the remanufacturing initiative include manufacturers of combustion engines and automation equipment, precision engineering service providers and companies interested in venturing into remanufacturing.
